Microelectronics packaging handbook / edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein.

Contributor(s): Tummala, Rao R, 1942- | Rymaszewski, Eugene J
Language: English Publisher: New York : Chapman & Hall , c1997Edition: Second editionDescription: xxi: 720 pages: illustrations; 24 cmContent type: text Media type: unmediated Carrier type: volume ISBN: 0412084317 (pt. 1); 0412084414 (pt. 2); 0412084511 (pt. 3); 9780412084317Subject(s): Microelectronic packaging -- Handbooks, manuals, etcDDC classification: 621.381/046 LOC classification: TK7874 | .M485 1997
Contents:
pt. 1. Technology drivers -- pt. 2. Semiconductor packaging -- pt. 3. Subsystem packaging.
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Item type Current location Home library Call number Status Date due Barcode Item holds
BOOK BOOK COLLEGE LIBRARY
COLLEGE LIBRARY
GENERAL REFERENCE 		621.381046 M583 1997 pt.1 (Browse shelf) Available CITU-CL-24816
Total holds: 0

includes index

Includes bibliographical references and index.

pt. 1. Technology drivers -- pt. 2. Semiconductor packaging -- pt. 3. Subsystem packaging.

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