Microelectronics packaging handbook / edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein. - Second edition - xxi: 720 pages: illustrations; 24 cm.

includes index

Includes bibliographical references and index.

pt. 1. Technology drivers -- pt. 2. Semiconductor packaging -- pt. 3. Subsystem packaging.

0412084317 (pt. 1) 0412084414 (pt. 2) 0412084511 (pt. 3) 9780412084317

96037907


Microelectronic packaging--Handbooks, manuals, etc.

TK7874 / .M485 1997

621.381/046