Advanced MEMS packaging / John H. Lau ... [et al.].

Contributor(s): Lau, John H
Publisher: New York : McGraw-Hill, c2010Description: xxiii, 552 p. : ill. ; 24 cmISBN: 9780071626231 (alk. paper); 0071626239 (alk. paper)Other title: Advanced microelectromechanical systems packagingSubject(s): Microelectromechanical systems | Microelectronic packagingDDC classification: 621.381046 LOC classification: TK7875 | .A378 2010
Contents:
Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices.
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SUBJECT REFERENCE 		621.381046 Ad95 2010 (Browse shelf) Available CITU-CL-41587
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Includes bibliographical references and index.

Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices.

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