Advances in embedded and fan-out wafer level packaging technologies / [edited by] Beth Keser, Ph.D., Steffen Kroehnert.
Contributor(s): Keser, Beth [editor.] | Kroehnert, Steffen [editor.]
Publisher: Hoboken, NJ : Wiley, [2018]Edition: 1st editionDescription: 1 online resourceContent type: text Media type: computer Carrier type: online resourceISBN: 9781119313984 (ePub); 9781119313977 (Adobe PDF); 9781119313991Subject(s): Chip scale packaging | Integrated circuits -- Wafer scale integrationDDC classification: 621.39/5 LOC classification: TK7870.17Online resources: Full text available at Wiley Online Library Click here to view| Item type | Current location | Home library | Call number | Status | Date due | Barcode | Item holds |
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EBOOK
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COLLEGE LIBRARY | COLLEGE LIBRARY | 621.395 Ad955 2018 (Browse shelf) | Available | CL-52010 |
Total holds: 0
Includes bibliographical references and index.
Description based on print version record and CIP data provided by publisher.
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