Normal view MARC view ISBD view

Advances in embedded and fan-out wafer level packaging technologies / [edited by] Beth Keser, Ph.D., Steffen Kroehnert. - 1st edition. - 1 online resource.

Includes bibliographical references and index.

ISBN: 9781119313984 (ePub) 9781119313977 (Adobe PDF) 9781119313991

LCCN: 2018037473

Subjects--Topical Terms:
Chip scale packaging.
Integrated circuits--Wafer scale integration.

LC Class. No.: TK7870.17

Dewey Class. No.: 621.39/5