Microelectronics packaging handbook / edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein.
Contributor(s): Tummala, Rao R | Rymaszewski, Eugene J
Language: English Publisher: New York : Chapman & Hall , c1997Edition: Second editionDescription: xxi: 720 pages: illustrations; 24 cmContent type: text Media type: unmediated Carrier type: volume ISBN: 0412084317 (pt. 1); 0412084414 (pt. 2); 0412084511 (pt. 3); 9780412084317Subject(s): Microelectronic packaging -- Handbooks, manuals, etcDDC classification: 621.381/046 LOC classification: TK7874 | .M485 1997
Contents:
pt. 1. Technology drivers -- pt. 2. Semiconductor packaging -- pt. 3. Subsystem packaging.
| Item type | Current location | Home library | Call number | Status | Date due | Barcode | Item holds |
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COLLEGE LIBRARY | COLLEGE LIBRARY GENERAL REFERENCE | 621.381046 M583 1997 pt.1 (Browse shelf) | Available | CITU-CL-24816 |
Total holds: 0
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| 621.38103 M342 1978 Electronics dictionary / | 621.38103 M342 1978 Electronics dictionary / | 621.3810321 M178 1984 McGraw-Hill dictionary of electronics and computer technology / | 621.381046 M583 1997 pt.1 Microelectronics packaging handbook / | 621.38104602 H191 1969 Handbook of electronic packaging / | 621.381092 M178 1979 McGraw-Hill leaders in electronics / | 621.38122 St24 2005 Standard handbook of electronic engineering / |
includes index
Includes bibliographical references and index.
pt. 1. Technology drivers -- pt. 2. Semiconductor packaging -- pt. 3. Subsystem packaging.
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