000			01337nab a22001577a 4500
999			_c83773 _d83773
005			20230119082619.0
008			230119b ||||| |||| 00| 0 eng d
100	1		_aMena, Manolo G. _eauthor
245	1	0	_aElectrochemical migration of silver in electronics applications
264		4	_c2016
520	3		_aSilver (Ag) filler is the most attractive choice among all conductive fillers. However, silver electrochemically migrates in the presence of moisture and applied bias. In microelectronic devices, silver migration usually occurs between adjacent conductors/electrodes, which leads to the formation of dendrites and eventually results in short-circuit failure. An investigation for two types of filler was done using the water drop test and a 1000-hour temperature-humidity-bias (THB) test. Four different bias voltages and six different distance spacing were used for each of the two fillers. The higher voltage requirement for Ag migration to occur for epoxy A than for epoxy C was attributed to the high volume resistivity of epoxy A. It was discovered that an electric field value of more than ! volt/mm will Ag migration.
650		0	_aElectrochemical analysis
700	1		_aMena-Junio, Marie Stephanie S. _eauthor
773			_tPhilippine Engineering Journal _gvol. 37, no. 2: (December 2016), pages 23-36
942			_2ddc _cART