| 000 | 01499cam a22004091i 4500 | ||
|---|---|---|---|
| 999 |
_c79736 _d79736 |
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| 001 | 20616547 | ||
| 005 | 20211106155037.0 | ||
| 006 | m |o d | | ||
| 007 | cr_||||||||||| | ||
| 008 | 180804s2018 nju ob 001 0 eng | ||
| 010 | _a 2018037473 | ||
| 020 | _a9781119313984 (ePub) | ||
| 020 | _a9781119313977 (Adobe PDF) | ||
| 020 | _z9781119314134 (hardcover) | ||
| 020 | _a9781119313991 | ||
| 040 |
_aDLC _beng _erda _cDLC _dDLC |
||
| 042 | _apcc | ||
| 050 | 1 | 0 | _aTK7870.17 |
| 082 | 0 | 0 |
_a621.39/5 _223 |
| 245 | 0 | 0 |
_aAdvances in embedded and fan-out wafer level packaging technologies / _c[edited by] Beth Keser, Ph.D., Steffen Kroehnert. |
| 250 | _a1st edition. | ||
| 264 | 1 |
_aHoboken, NJ : _bWiley, _c[2018] |
|
| 300 | _a1 online resource. | ||
| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_acomputer _bn _2rdamedia |
||
| 338 |
_aonline resource _bnc _2rdacarrier |
||
| 504 | _aIncludes bibliographical references and index. | ||
| 588 | _aDescription based on print version record and CIP data provided by publisher. | ||
| 650 | 0 | _aChip scale packaging. | |
| 650 | 0 |
_aIntegrated circuits _xWafer scale integration. |
|
| 700 | 1 |
_aKeser, Beth, _d1971- _eeditor. |
|
| 700 | 1 |
_aKroehnert, Steffen, _d1970- _eeditor. |
|
| 856 |
_yFull text available at Wiley Online Library Click here to view _uhttps://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991 |
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| 906 |
_a7 _bcbc _corigcop _d1 _eecip _f20 _gy-gencatlg |
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| 942 |
_2ddc _cER |
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