| 000 | 01521cam a2200313 a 4500 | ||
|---|---|---|---|
| 999 |
_c52465 _d52465 |
||
| 001 | 15956240 | ||
| 003 | CITU | ||
| 005 | 20201103065230.0 | ||
| 008 | 091022s2010 nyua b 001 0 eng | ||
| 010 | _a 2009040456 | ||
| 020 | _a9780071626231 (alk. paper) | ||
| 020 | _a0071626239 (alk. paper) | ||
| 035 | _a(OCoLC)ocn277205716 | ||
| 040 |
_aDLC _cDLC _dYDX _dBWX _dOKU _dDLC |
||
| 050 | 0 | 0 |
_aTK7875 _b.A378 2010 |
| 082 | 0 | 0 |
_a621.381046 _222 |
| 245 | 0 | 0 |
_aAdvanced MEMS packaging / _cJohn H. Lau ... [et al.]. |
| 246 | 3 | _aAdvanced microelectromechanical systems packaging | |
| 260 |
_aNew York : _bMcGraw-Hill, _cc2010. |
||
| 300 |
_axxiii, 552 p. : _bill. ; _c24 cm. |
||
| 504 | _aIncludes bibliographical references and index. | ||
| 505 | 0 | _aEnabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices. | |
| 650 | 0 | _aMicroelectromechanical systems. | |
| 650 | 0 | _aMicroelectronic packaging. | |
| 700 | 1 | _aLau, John H. | |
| 906 |
_a7 _bcbc _corignew _d1 _eecip _f20 _gy-gencatlg |
||
| 942 |
_2ddc _cBK |
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