| 000 | 01411cam a2200385 a 4500 | ||
|---|---|---|---|
| 999 |
_c47803 _d47803 |
||
| 001 | 3054006 | ||
| 003 | CITU | ||
| 005 | 20240729135814.0 | ||
| 008 | 961125s1997 nyua bf 001 0 eng | ||
| 010 | _a 96037907 | ||
| 020 | _a0412084317 (pt. 1) | ||
| 020 | _a0412084414 (pt. 2) | ||
| 020 | _a0412084511 (pt. 3) | ||
| 020 | _a9780412084317 | ||
| 040 |
_aCITU LRAC _cDLC _dDLC _beng |
||
| 041 | _aeng | ||
| 050 | 0 | 0 |
_aTK7874 _b.M485 1997 |
| 082 | 0 | 0 |
_a621.381/046 _221 |
| 245 | 0 | 0 |
_aMicroelectronics packaging handbook / _cedited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein. |
| 250 | _aSecond edition | ||
| 264 | 1 |
_aNew York : _bChapman & Hall , _cc1997. |
|
| 300 |
_axxi: 720 pages: _billustrations; _c24 cm. |
||
| 336 |
_2rdacontent _atext _btxt |
||
| 337 |
_2rdamedia _aunmediated _bn |
||
| 338 |
_2rdacarrier _avolume _bnc |
||
| 500 | _aincludes index | ||
| 504 | _aIncludes bibliographical references and index. | ||
| 505 | 0 | _apt. 1. Technology drivers -- pt. 2. Semiconductor packaging -- pt. 3. Subsystem packaging. | |
| 650 | 0 |
_aMicroelectronic packaging _xHandbooks, manuals, etc. |
|
| 700 | 1 |
_aTummala, Rao R., _d1942- |
|
| 700 | 1 | _aRymaszewski, Eugene J. | |
| 906 |
_a7 _bcbc _corignew _d1 _eocip _f19 _gy-gencatlg |
||
| 942 |
_2ddc _cBK |
||