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Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package / edited by Beth Keser, Steffen Krohnert.

by Keser, Beth, 1971- [editor.] | Krohnert, Steffen [editor.].

Language: English Publisher: Newark : John Wiley & Sons, Incorporated, 2021Online access: Full text available at Wiley Online Library Click here to view Availability: Items available for loan: COLLEGE LIBRARY [Call number: 621.381046 Em13 2022] (1).

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Advances in embedded and fan-out wafer level packaging technologies / [edited by] Beth Keser, Ph.D., Steffen Kroehnert.

by Keser, Beth, 1971- [editor.] | Kroehnert, Steffen, 1970- [editor.].

Edition: 1st edition.Publisher: Hoboken, NJ : Wiley, [2018]Online access: Full text available at Wiley Online Library Click here to view Availability: Items available for loan: COLLEGE LIBRARY [Call number: 621.395 Ad955 2018] (1).

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