Your search returned 3 results.

Electronic packaging materials science.

by Materials Research Society.

Publisher: Pittsburgh, Pa. : Materials Research Society, c1985Availability: Items available for loan: COLLEGE LIBRARY [Call number: 621.381 El25 1985] (1).

Place hold
Lead-free soldering process development and reliability / Jasbir Bath.

by Bath, Jasbir [editor.].

Language: English Publisher: Hoboken, New Jersey : John Wiley & Sons, Inc., c2020Online access: Full text available at Wiley Online Library Click here to view Availability: Items available for loan: COLLEGE LIBRARY [Call number: 621.381046 B3201 2020] (1).

Place hold
Polymeric materials for electronic packaging / Shozo Nakamura.

by Nakamura, Shozo (Professor Emeritus) [author.].

Language: English Publisher: Hoboken, New Jersey : Piscataway, NJ : John Wiley & Sons, Inc. ; IEEE Press, [2023]Online access: Full text is available at Wiley Online Library Click here to view Availability: Items available for loan: COLLEGE LIBRARY [Call number: 620.19204297 N1455 2023] (1).

Place hold