Advanced MEMS packaging / 
 Advanced microelectromechanical systems packaging 
John H. Lau ... [et al.]. 
 - New York :  McGraw-Hill,  c2010. 
 - xxiii, 552 p. :  ill. ;  24 cm. 
<br/><br/>Includes bibliographical references and index. 
<br/><br/>Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices. 
<br/><br/><label>ISBN: </label>9780071626231 (alk. paper) 0071626239 (alk. paper) 
<br/><br/><label>LCCN: </label>2009040456 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectromechanical systems.<br/>Microelectronic packaging.
<br/><br/><label>LC Class. No.: </label>TK7875  / .A378 2010 
<br/><br/><label>Dewey Class. No.: </label>621.381046