Microelectronics packaging handbook / 
edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein. 
 - Second edition 
 - xxi: 720 pages:  illustrations;  24 cm. 
<br/><br/> includes index 
<br/><br/>Includes bibliographical references and index. 
<br/><br/>pt. 1. Technology drivers -- pt. 2. Semiconductor packaging -- pt. 3. Subsystem packaging. 
<br/><br/><label>ISBN: </label>0412084317 (pt. 1) 0412084414 (pt. 2) 0412084511 (pt. 3) 9780412084317 
<br/><br/><label>LCCN: </label>96037907  
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging--Handbooks, manuals, etc.
<br/><br/><label>LC Class. No.: </label>TK7874  / .M485 1997 
<br/><br/><label>Dewey Class. No.: </label>621.381/046