Principles of laser materials processing : developments and applications / Elijah Kannatey-Asibu, Jr.

By: Kannatey-Asibu, E [author.]
Language: English Publisher: Hoboken, NJ : Wiley, 2023Edition: Second editionDescription: 1 online resourceContent type: text Media type: computer Carrier type: online resourceISBN: 9781119881605; 9781119881636; 1119881633; 9781119881629; 1119881625; 9781119881612; 1119881617Subject(s): Lasers -- Industrial applications | Materials scienceGenre/Form: Electronic books.DDC classification: 621.36/6 LOC classification: TA1675Online resources: Full text is available at Wiley Online Library Click here to view
Contents:
Table of Contents PREFACE TO THE SECOND EDITION xxi PREFACE TO THE FIRST EDITION xxiii ABOUT THE COMPANION WEBSITE xxv PART I PRINCIPLES OF INDUSTRIAL LASERS 1 1 Laser Background 3 1.1 Laser Generation 3 1.2 Optical Resonators 12 1.3 Laser Pumping 21 1.4 System Levels 24 1.5 Broadening Mechanisms 26 1.6 Beam Modification 29 1.7 Beam Characteristics 35 1.8 Summary 43 2 Types of Lasers 55 2.1 Solid-State Lasers 55 2.2 Gas Lasers 57 2.3 Semiconductor (Diode) Lasers 69 2.4 New Developments in Industrial Laser Technology 80 2.5 Summary 89 3 Beam Delivery 95 3.1 The Electromagnetic Spectrum 95 3.2 Birefringence 96 3.3 Brewster Angle 96 3.4 Polarization 98 3.5 Beam Expanders 101 3.6 Beam Splitters 102 3.7 Beam Delivery Systems 103 3.8 Beam Shaping 116 3.9 Summary 125 PART II ENGINEERING BACKGROUND 133 4 Heat and Fluid Flow 135 4.1 Energy Balance During Processing 135 4.2 Heat Flow in the Workpiece 136 4.3 Fluid Flow in Molten Pool 156 4.4 Summary 161 5 The Microstructure 175 5.1 Process Microstructure 175 5.2 Discontinuities 195 5.3 Summary 202 6 Solidification 209 6.1 Solidification Without Flow 209 6.2 Solidification with Flow 216 6.3 Rapid Solidification 221 6.4 Summary 222 7 Residual Stresses and Distortion 227 7.1 Causes of Residual Stresses 227 7.2 Basic Stress Analysis 232 7.3 Effects of Residual Stresses 237 7.4 Measurement of Residual Stresses 240 7.5 Relief of Residual Stresses and Distortion 250 7.6 Summary 252 PART III LASER MATERIALS PROCESSING 261 8 Background on Laser Processing 263 8.1 System-Related Parameters 263 8.2 Process Efficiency 272 8.3 Disturbances That Affect Process Quality 274 8.4 General Advantages and Disadvantages of Laser Processing 275 8.5 Summary 275 9 Laser Cutting and Drilling 279 9.1 Laser Cutting 279 9.2 Laser Drilling 308 9.3 New Developments 318 9.4 Summary 326 10 Laser Welding 335 10.1 Laser Welding Parameters 335 10.2 Welding Efficiency 344 10.3 Mechanism of Laser Welding 344 10.4 Material Considerations 355 10.5 Weldment Discontinuities 359 10.6 Advantages and Disadvantages of Laser Welding 360 10.7 Special Techniques 360 10.8 Specific Applications 371 10.9 Summary 382 11 Laser Surface Modification 391 11.1 Laser Surface Heat Treatment 391 11.2 Laser Surface Melting 413 11.3 Laser Direct Metal Deposition 414 11.4 Laser Physical Vapor Deposition (LPVD) 419 11.5 Laser Shock Peening 420 11.6 Laser Texturing 427 11.7 Summary 429 12 Laser Forming 437 12.1 Principle of Laser Forming 437 12.2 Process Parameters 439 12.3 Laser-Forming Mechanisms 439 12.4 Process Analysis 443 12.5 Advantages and Disadvantages 447 12.6 Applications 448 12.7 Summary 448 13 Additive Manufacturing 453 13.1 Computer-Aided Design 453 13.2 Part Building 462 13.3 Post-Processing 477 13.4 Applications 478 13.5 Advantages and Disadvantages 480 13.6 Summary 480 14 Medical and Nanotechnology Applications of Lasers 485 14.1 Medical Applications 485 14.2 Nanotechnology Applications 490 14.3 Summary 494 15 Sensors for Process Monitoring 497 15.1 Laser Beam Monitoring 497 15.2 Process Monitoring 504 15.3 Summary 522 16 Processing of Sensor Outputs 527 16.1 Signal Transformation 527 16.2 Data Reduction 532 16.3 Pattern Classification 534 16.4 Summary 550 17 Laser Safety 557 17.1 Laser Hazards 557 17.2 Laser Classification 562 17.3 Preventing Laser Accidents 563 17.4 Summary 569 Appendix 17.A 571 Problem 572 Bibliography 572 Index 573
Summary: "Principles of Laser Materials Processing, Second Edition updates solved example problems and problem sets suitable for the readers' further understanding of the technology explained. Split into three parts, the author introduces basic concepts, including the characteristics of lasers and the design of their components to aid readers in their initial understanding of the technology. This book delves into the background of laser materials and provides a state-of-the-art compilation of material in the major application areas such as laser cutting and drilling, welding, surface modification, and laser forming among many others. This text presents information on laser safety to prepare the reader for working in the industry sector and to provide practicing engineers the updates needed to work safely and effectively. Comprised of 23 chapters and made up of 3 parts, this second edition provides updated content on the important fields within laser materials processing and is supported with a solutions manual for the readers' in-depth learning experience."-- Provided by publisher.
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Includes bibliographical references and index.

Table of Contents
PREFACE TO THE SECOND EDITION xxi

PREFACE TO THE FIRST EDITION xxiii

ABOUT THE COMPANION WEBSITE xxv

PART I PRINCIPLES OF INDUSTRIAL LASERS 1

1 Laser Background 3

1.1 Laser Generation 3

1.2 Optical Resonators 12

1.3 Laser Pumping 21

1.4 System Levels 24

1.5 Broadening Mechanisms 26

1.6 Beam Modification 29

1.7 Beam Characteristics 35

1.8 Summary 43

2 Types of Lasers 55

2.1 Solid-State Lasers 55

2.2 Gas Lasers 57

2.3 Semiconductor (Diode) Lasers 69

2.4 New Developments in Industrial Laser Technology 80

2.5 Summary 89

3 Beam Delivery 95

3.1 The Electromagnetic Spectrum 95

3.2 Birefringence 96

3.3 Brewster Angle 96

3.4 Polarization 98

3.5 Beam Expanders 101

3.6 Beam Splitters 102

3.7 Beam Delivery Systems 103

3.8 Beam Shaping 116

3.9 Summary 125

PART II ENGINEERING BACKGROUND 133

4 Heat and Fluid Flow 135

4.1 Energy Balance During Processing 135

4.2 Heat Flow in the Workpiece 136

4.3 Fluid Flow in Molten Pool 156

4.4 Summary 161

5 The Microstructure 175

5.1 Process Microstructure 175

5.2 Discontinuities 195

5.3 Summary 202

6 Solidification 209

6.1 Solidification Without Flow 209

6.2 Solidification with Flow 216

6.3 Rapid Solidification 221

6.4 Summary 222

7 Residual Stresses and Distortion 227

7.1 Causes of Residual Stresses 227

7.2 Basic Stress Analysis 232

7.3 Effects of Residual Stresses 237

7.4 Measurement of Residual Stresses 240

7.5 Relief of Residual Stresses and Distortion 250

7.6 Summary 252

PART III LASER MATERIALS PROCESSING 261

8 Background on Laser Processing 263

8.1 System-Related Parameters 263

8.2 Process Efficiency 272

8.3 Disturbances That Affect Process Quality 274

8.4 General Advantages and Disadvantages of Laser Processing 275

8.5 Summary 275

9 Laser Cutting and Drilling 279

9.1 Laser Cutting 279

9.2 Laser Drilling 308

9.3 New Developments 318

9.4 Summary 326

10 Laser Welding 335

10.1 Laser Welding Parameters 335

10.2 Welding Efficiency 344

10.3 Mechanism of Laser Welding 344

10.4 Material Considerations 355

10.5 Weldment Discontinuities 359

10.6 Advantages and Disadvantages of Laser Welding 360

10.7 Special Techniques 360

10.8 Specific Applications 371

10.9 Summary 382

11 Laser Surface Modification 391

11.1 Laser Surface Heat Treatment 391

11.2 Laser Surface Melting 413

11.3 Laser Direct Metal Deposition 414

11.4 Laser Physical Vapor Deposition (LPVD) 419

11.5 Laser Shock Peening 420

11.6 Laser Texturing 427

11.7 Summary 429

12 Laser Forming 437

12.1 Principle of Laser Forming 437

12.2 Process Parameters 439

12.3 Laser-Forming Mechanisms 439

12.4 Process Analysis 443

12.5 Advantages and Disadvantages 447

12.6 Applications 448

12.7 Summary 448

13 Additive Manufacturing 453

13.1 Computer-Aided Design 453

13.2 Part Building 462

13.3 Post-Processing 477

13.4 Applications 478

13.5 Advantages and Disadvantages 480

13.6 Summary 480

14 Medical and Nanotechnology Applications of Lasers 485

14.1 Medical Applications 485

14.2 Nanotechnology Applications 490

14.3 Summary 494

15 Sensors for Process Monitoring 497

15.1 Laser Beam Monitoring 497

15.2 Process Monitoring 504

15.3 Summary 522

16 Processing of Sensor Outputs 527

16.1 Signal Transformation 527

16.2 Data Reduction 532

16.3 Pattern Classification 534

16.4 Summary 550

17 Laser Safety 557

17.1 Laser Hazards 557

17.2 Laser Classification 562

17.3 Preventing Laser Accidents 563

17.4 Summary 569

Appendix 17.A 571

Problem 572

Bibliography 572

Index 573

"Principles of Laser Materials Processing, Second Edition updates solved example problems and problem sets suitable for the readers' further understanding of the technology explained. Split into three parts, the author introduces basic concepts, including the characteristics of lasers and the design of their components to aid readers in their initial understanding of the technology. This book delves into the background of laser materials and provides a state-of-the-art compilation of material in the major application areas such as laser cutting and drilling, welding, surface modification, and laser forming among many others. This text presents information on laser safety to prepare the reader for working in the industry sector and to provide practicing engineers the updates needed to work safely and effectively. Comprised of 23 chapters and made up of 3 parts, this second edition provides updated content on the important fields within laser materials processing and is supported with a solutions manual for the readers' in-depth learning experience."-- Provided by publisher.

About the Author
Dr. Elijah Kannatey-Asibu, JR., PhD, received his PhD from the University of California at Berkeley, USA, in 1980. He is now Professor Emeritus of Mechanical Engineering at the University of Michigan in Ann Arbor, where he was Professor until 2020. His research focused on multi-sensor monitoring of manufacturing processes, multiple-beam laser processing, acoustic emission investigation of manufacturing processes, and microfabrication using femtosecond lasers.

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