Polymeric materials for electronic packaging / (Record no. 91615)

000 -LEADER
fixed length control field 06897cam a2200505 i 4500
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20250803172423.0
006 - FIXED-LENGTH DATA ELEMENTS--ADDITIONAL MATERIAL CHARACTERISTICS--GENERAL INFORMATION
fixed length control field m o d
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION
fixed length control field cr cnu---unuuu
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 250803s2023 njua ob 001 0 eng
010 ## - LIBRARY OF CONGRESS CONTROL NUMBER
LC control number 2023013758
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9781394188796
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9781394188819
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9781394188826
Qualifying information electronic book
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 139418882X
Qualifying information electronic book
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 1394188811
Qualifying information electronic book
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9781394188802
Qualifying information electronic book
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 1394188803
Qualifying information electronic book
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9781394188819
Qualifying information (electronic bk.)
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
Cancelled/invalid ISBN 9781394188796
Qualifying information hardcover
024 7# - OTHER STANDARD IDENTIFIER
Standard number or code 10.1002/9781394188826
Source of number or code doi
035 ## - SYSTEM CONTROL NUMBER
System control number (OCoLC)1389722390
035 #9 - SYSTEM CONTROL NUMBER
System control number (OCLCCM-Owned)1389722390
037 ## - SOURCE OF ACQUISITION
Stock number 10287767
Source of stock number/acquisition IEEE
041 ## - LANGUAGE CODE
Language code of text/sound track or separate title eng
042 ## - AUTHENTICATION CODE
Authentication code pcc
049 ## - LOCAL HOLDINGS (OCLC)
Holding library MAIN
082 00 - DEWEY DECIMAL CLASSIFICATION NUMBER
Edition number 2
Classification number 620.1/9204297
100 1# - MAIN ENTRY--PERSONAL NAME
Preferred name for the person Nakamura, Shozo
Titles and other words associated with a name (Professor Emeritus),
Relator term author.
Authority record control number http://id.loc.gov/authorities/names/no2023038923
245 10 - TITLE STATEMENT
Title Polymeric materials for electronic packaging /
Statement of responsibility, etc Shozo Nakamura.
264 #1 - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT)
Place of publication, distribution, etc Hoboken, New Jersey :
Name of publisher, distributor, etc John Wiley & Sons, Inc. ;
Place of publication, distribution, etc Piscataway, NJ :
Name of publisher, distributor, etc IEEE Press,
Date of publication, distribution, etc [2023]
300 ## - PHYSICAL DESCRIPTION
Extent 1 online resource (xiii, 189 pages) :
Other physical details illustrations (some color)
336 ## - CONTENT TYPE
Content type term text
Content type code txt
Source rdacontent
337 ## - MEDIA TYPE
Media type term computer
Media type code c
Source rdamedia
338 ## - CARRIER TYPE
Carrier type term online resource
Carrier type code cr
Source rdacarrier
504 ## - BIBLIOGRAPHY, ETC. NOTE
Bibliography, etc Includes bibliographical references and index.
505 0# - CONTENTS
Formatted contents note Table of Contents<br/>About the Author ix<br/><br/>Preface xi<br/><br/>1 Basics of Semiconductor 1<br/><br/>1.1 Development of Semiconductors 1<br/><br/>1.2 Analysis of Semiconductors Materials 5<br/><br/>2 Basics of Polymer Materials 9<br/><br/>2.1 Polymer Material 9<br/><br/>2.2 Types and Classification of Polymer Materials 10<br/><br/>2.3 General Properties of Polymer Materials 12<br/><br/>2.4 Summary 13<br/><br/>3 Basics of Elastic Theory 15<br/><br/>3.1 Elasticity 15<br/><br/>3.2 Stress and Strain 15<br/><br/>3.3 Finite Element Method Analysis (FEM Analysis) 16<br/><br/>3.4 Governing Equation of Elastic Body 18<br/><br/>3.5 Law of Elastic Breakage 19<br/><br/>3.6 Plane Stress and Plane Strain 21<br/><br/>4 Stress Evaluations with Defects 23<br/><br/>4.1 Difference from Strength of Materials 23<br/><br/>4.2 Stress Concentration and Stress Intensity Factor 24<br/><br/>5 Basics of Viscoelasticity 27<br/><br/>5.1 About Viscoelasticity 27<br/><br/>5.2 Elasticity, Viscosity, and Viscoelasticity 28<br/><br/>5.3 Stress and Strain Response 29<br/><br/>5.4 Mechanical Model Representing Viscoelastic Properties 32<br/><br/>5.5 Conceptual Formula for Creep and Stress Relaxation 35<br/><br/>5.6 Master Curve and Time-Temperature Conversion Rule 38<br/><br/>5.7 Approximation of Master Curve 39<br/><br/>5.8 Superposition Principle and Basic Equations 40<br/><br/>5.9 Simple Model of Generating Thermal Stress and Strain 41<br/><br/>6 Measurement of Viscoelastic Properties 43<br/><br/>6.1 Dynamic Viscoelasticity 43<br/><br/>6.2 Measurement Method 43<br/><br/>6.3 Complex Modulus and Mechanical Model 44<br/><br/>6.4 Dispersion and Absorption by Frequency 46<br/><br/>6.5 Actual Measurement Example 48<br/><br/>7 Design Issues of LSI Packages 49<br/><br/>7.1 Introduction 49<br/><br/>7.2 Trends and Issues of LSI Packages 51<br/><br/>8 Validity of Viscoelastic Analysis 55<br/><br/>8.1 Introduction 55<br/><br/>8.2 Structure of Laminated Body 56<br/><br/>8.3 Analysis Method 61<br/><br/>8.4 Cooling Experiment of Laminated Body 61<br/><br/>8.5 Analysis Results and Experimental Values 63<br/><br/>8.6 Conclusion 67<br/><br/>9 Application to CSP-μBGA 69<br/><br/>9.1 Introduction 69<br/><br/>9.2 Structure and Modeling of CSP-μBGA 69<br/><br/>9.3 Material Property Values Used for Analysis 70<br/><br/>9.4 Material and Structure Optimization Design by VESAP Analysis 73<br/><br/>10 Thermal Stress and Warpage Behavior During Cooling Process of Three-Layer Laminate 79<br/><br/>10.1 Introduction 79<br/><br/>10.2 Structure of LSI Package 79<br/><br/>10.3 Three-Layer Viscoelastic Laminate Model 80<br/><br/>10.4 Elucidation of Warpage Deformation Behavior by VESAP Analysis 81<br/><br/>11 Warp Deformation Behavior From Heating to Cooling 91<br/><br/>11.1 Introduction 91<br/><br/>11.2 Two-Layer Laminate With Epoxy Resin/FR-4 Substrate 92<br/><br/>11.3 Two-Layer Laminate with Epoxy Resin/Steel 101<br/><br/>11.4 Three-Layer Laminate with Steel/Epoxy Resin/Printed Board 104<br/><br/>11.5 Analysis Experiment of Four-Layer Laminate 108<br/><br/>12 Deformation Prediction Method Considering Curing Shrinkage of Resin 119<br/><br/>12.1 Introduction 119<br/><br/>12.2 Examination the Procedure and the Way of Thinking 120<br/><br/>12.3 Contents of VESAP Analysis 122<br/><br/>12.4 Simple Prediction Formula for Calculating Curing Warpage 123<br/><br/>12.5 Warp Deformation Experiment 128<br/><br/>12.6 Theoretical Prediction of Warpage Deformation due to Hardening and Heat 130<br/><br/>13 Changes in Material Properties and Deformation Behavior Due to Thermal Degradation 133<br/><br/>13.1 Purpose and Background 133<br/><br/>13.2 Experimental Case I 134<br/><br/>13.3 Experiment of Case II 139<br/><br/>14 Simple Evaluation Method for Deformation of Viscoelastic Body 147<br/><br/>14.1 Introduction 147<br/><br/>14.2 Derivation of Simple Formula 147<br/><br/>14.3 Practical Method 151<br/><br/>14.4 Determining the Curing Temperature of the Resin 152<br/><br/>14.5 Effect of Epoxy Resin Thickness on Heat Generation Temperature 153<br/><br/>14.6 Conclusion 156<br/><br/>15 Effect of Cooling Rate on Warpage Behavior of Laminates 159<br/><br/>15.1 Warp Deformation Experiment 159<br/><br/>15.2 VESAP Analysis 160<br/><br/>15.3 Results and Considerations 163<br/><br/>15.4 Final Warp Deformation and Residual Warp Deformation 166<br/><br/>15.5 Estimation Mechanism Between Cooling Rate and Deformation of Laminate 168<br/><br/>15.6 Conclusion 169<br/><br/>Appendix A Development of Viscoelastic Analysis Software (VESAP) 171<br/><br/>A.1 Development Needs and Concepts 171<br/><br/>A.2 Derivation of Basic Formula for Analysis 172<br/><br/>A.3 Contents of the Developed VESAP Software 175<br/><br/>Bibliography 179<br/><br/>Index 185
520 ## - SUMMARY, ETC.
Summary, etc "Polymers are normally electrical insulators but, to enable their use in electronic applications, conductive fillers such as silver have been added to polymer formulations to increase their electrical conductivity. Unlike metal components, by using high performance polymers, engineers can reduce processing cycle times and increase durability in demanding environments. Some of the key benefits of replacing metals with polymers include weight reductions of up to 80%, and 30% faster installation times, ideal for hand-held devices and equipment."--
Assigning source Provided by publisher.
545 0# - BIOGRAPHICAL OR HISTORICAL DATA
Biographical or historical note About the Author<br/>Shozo Nakamura, PhD, is Professor Emeritus at the Hiroshima Institute of Technology, Japan, and a sought-after corporate technical adviser. In 2019, he established the Nakamura Technical Research Institute.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Conducting polymers.
Authority record control number http://id.loc.gov/authorities/subjects/sh90000920
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Electronic packaging.
Authority record control number http://id.loc.gov/authorities/subjects/sh85042366
655 #4 - INDEX TERM--GENRE/FORM
Genre/form data or focus term Elecronic books.
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier https://onlinelibrary.wiley.com/doi/book/10.1002/9781394188826
Link text Full text is available at Wiley Online Library Click here to view
942 ## - ADDED ENTRY ELEMENTS
Source of classification or shelving scheme
Item type EBOOK
Holdings
Withdrawn status Lost status Source of classification or shelving scheme Damaged status Not for loan Permanent Location Current Location Date acquired Full call number Date last seen Price effective from Item type
          COLLEGE LIBRARY COLLEGE LIBRARY 2025-08-03 620.19204297 N1455 2023 2025-08-03 2025-08-03 EBOOK